[8월] 월간 hy-way(경력)
에스케이하이닉스(주) · 마감
- 접수 기간
- 2026-08-07 ~ 2026-08-19
- 근무지
- 경기/인천 - 이천, 경기/인천 - 이천/분당/서울
Tech R&D - Bonding (경력·정규직)
Tech R&D - Process Integration (경력·정규직)
Tech R&D - 회로설계(HBM) (경력·정규직)
Tech R&D - HBM Digital Design(RTL design) (경력·정규직)
Tech R&D - HBM Digital Design(Front-end) (경력·정규직)
Tech R&D - HBM Digital Design(Back-end) (경력·정규직)
Tech R&D - HBM Digital Design(검증) (경력·정규직)
Tech R&D - HBM PE (경력·정규직)
Tech R&D - HBM Digital Design(SoC Design) (경력·정규직)
Business - Next Memory Strategy (경력·정규직)
IT - CAD Engineering (경력·정규직)
Business - IR Communication (경력·정규직)